Dear J. J. Wang,

Refer to your response to Terry Zhu, did you mean that you had used SU8 to form
a electroplating mould and successfully plated gold? you used Cr layer and then
Omnicoat, followed by SU8 processing, finally electrolytic gold plating, right?
if not, would you please correct me?

I did the similiar thing but based on silver rather than Cr. However, I failed
because SU8 layer lift off after I plated gold and cool down.  I want to keep
the SU8 after plating because I want to plating another metal (Ni) on top of
Gold.

Would you please give me some advice?

Thanks a lot!

J. Zhu
> -----Original Message-----
> From: mems-talk-bounces@memsnet.org [SMTP:mems-talk-bounces@memsnet.org] On
Behalf Of polly
> Sent: 25 May 2006 13:04
> To:   mems-talk@memsnet.org
> Subject:      [mems-talk] query
>
>
> dear Sir
>
> i would to know the critical post metalization temperature after which
aluminum spikes into silicon.