Gareth,
            I am using AZ P-4620 photoresist as a masking material
during etching. You have suggested me a combination of aqueous
solution with 2% conc. HF + 2%conc. HNO3. Will the masking material
withstand this etchant.  I am trying to make channles having depth of
60-80 micron.

On 5/10/06, Gareth Jenkins  wrote:
> Hi Paul
>
> If I remember correctly it is approximately 0.1 um /min depending on how
> fresh the solution is.
>
> Paul Monaghan wrote:
>
> >Gareth,
> >
> >out of interest, what sort of etch rates do you get for sodalime glass with
> >that etchant?