Hello All,

Recently we got a sputtering machine that can deposit Aluminum thin films
and I am trying to figure out which process - E-beam evaporation or
Sputtering is best for depositing Aluminum thin films (thickness = 150 nm,
surface roughenss < 10 nm, grain size - tens of nm, with good surface
quality). Please let me know if you have any suggestions.

Thanks
Sreemanth