We have successfully used either:
1)a brief CHF3 plasma treatment of the micromachined silicon surface
in a small RIE chamber. This deposits a thin polymer release
layer, or
2) treatment by putting the silicon wafer in a dessicator with a
small beaker containing a few drops of tridecafluoro-1,1,2,2-
tetrahydooctyl)trichlorosilane. Pump on the dessicator with a small
lab vacuum pump for a few mimutes. I know there are other ---silanes
have been used, but I
am no chemist and used what I found in one reference.

Jim

On Aug 15, 2006, at 12:57 PM, Z xy wrote:

> Hi, We are looking for a type of mold release agent used for
> stripping off the PDMS layer from the silicon mold in nanoimprint fab.