Hi Chris,

Sorry, I didn't notify that you replied my post.

My target is about one year and at body temperature.

At what temperature and for how long will you be subjecting the system to?

Chris Tan

-----Original Message-----
From: mems-talk-bounces at memsnet.org [mailto:mems-talk-bounces at
memsnet.org]
On Behalf Of Mehdi Ahmadi
Sent: Monday, August 07, 2006 19:29
To: mems-talk at memsnet.org
Subject: [mems-talk] Ni is better or Pd as a diffusion barrier layer?

Hello

I'm going to deposit two metal tracks one of Au and one of Ag over a
quartz wafer (using evaporation and in a lift-off process). I need an
adhesion layer which I’m going to use Ti. Also I need a diffusion
barrier (to avoid
corrosion) which I'm in doubt whether Ni is better or Pd (Palladium).
Can anyone help me whether (Ti/Ni/Ag, Ti/Ni/Au) is better or (Ti/Pd/Ag,
Ti/Pd/Au)?

Another question is: if I want to deposit a layer of platinum (Pt), do I
need a diffusion barrier layer such Ni or Pd?
I'm asking this because Pt can itself be used as a diffusion barrier
layer (similar to Ni and Pd).