Addition to my original thoughts.  As SU-8 is an epoxy based resist it
is probable that an Epoxy based silane adhesion promoter would work
better.  There are numerous epoxy based silanes we can help with.
Bill Moffat, CEO
Yield Engineering Systems, Inc.
2185 Oakland Rd., San Jose, CA  95131
(408) 954-8353


-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of aeroalto
Sent: Friday, September 08, 2006 1:11 PM
To: mems-talk@memsnet.org
Cc: aeroalto@hotmail.com
Subject: [mems-talk] SU-8 adhesion problem

Hi all.

I am making a mold for electroplating Cu with SU-8 2015 on the glass
wafer.

Until developing process, it looks there is no problem(SU-8 looks
strongly adhered to the glass wafer).

But when I electroplate Cu, the SU-8 mold layer is perfectly peeled off.

Do you have any idea why this happens?

Does SU-8 have adhesion problem with glass wafer?