Use 50-100 A (5-10 nm) of Cr, Ti, or TiW.
Liftoff is easier as the galvanic gold-adhesion layer contact accelerates
undercut of some adhesion layers, such as Cr.
    --Kirt Williams

----- Original Message -----
From: "J.J HU" 
To: 
Sent: Friday, September 08, 2006 8:09 AM
Subject: [mems-talk] Adhesive layer for gold on oxide and patterning


> Hi all,
> I am trying to put down 300~500nm Au film on Si dioxide as electrodes, and
> I
> am just wondering what kind of adhesive layer (needs to be electrically
> conductive) should I deposit before Au to improve the adhesion?
>
> And anyone has some good thoughts about how to pattern the gold electrode
> (as well as the adhensive layer)? Will regular lift-off work?