This is a multi-part message in MIME format.

------=_NextPart_000_01BD8249.7FB90FA0
Content-Type: text/plain; charset=ISO-8859-1
Content-Transfer-Encoding: 7bit

see attachements

----------
> From: cjmm@ntl.pim.tsinghua.edu.cn
> To: MEMS@ISI.EDU
> Subject: look for glass bonding
> Date: Thursday, May 14, 1998 9:29 PM
>
>   I am looking for information on bonding or sealing of glass to glass.
The
> bond should be direct--I would like to avoid using bonding films or
> adhesives.  The bonding can be done at any temperature provided the glass
> parts are not deformed or distorted. I would appreciate any information
or
> leads.
>
> Thanks,
>
> Tang Yanghua
>
> MEMS LAB, Tsinghua Univ.
> P.R.China
> 100084
>
> 86-10-62785565
> FAX: 86-10-62784691
>
>
------=_NextPart_000_01BD8249.7FB90FA0
Content-Type: application/octet-stream; name="Silicon Fusion Bonding.url"
Content-Transfer-Encoding: base64
Content-Description: Silicon Fusion Bonding (Internet Shortcut)
Content-Disposition: attachment; filename="Silicon Fusion Bonding.url"

W0ludGVybmV0U2hvcnRjdXRdDQpVUkw9aHR0cDovL2JlbGwubW1hLmVkdS9+am1jZW50L21lbXNs
aW5rLmh0bWwAcAIAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAJR1RQBEvEUA

------=_NextPart_000_01BD8249.7FB90FA0
Content-Type: application/octet-stream; name="Review of papers from.url"
Content-Transfer-Encoding: base64
Content-Description: Review of papers from (Internet Shortcut)
Content-Disposition: attachment; filename="Review of papers from.url"

W0ludGVybmV0U2hvcnRjdXRdDQpVUkw9aHR0cDovL2JlbGwubW1hLmVkdS9+am1jZW50L1NGQnJl
dmlldy5odG0AcAIAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAABEvEUA

------=_NextPart_000_01BD8249.7FB90FA0--