Ravi, I am not sure about the photoresists you used. I use AZ5214E and spin it 5000rpm for 30s. It should measure about 1 micron or so. Then I soft bake the resist at 95'C for 1min before exposing it at 4.3mW/cm2 for about 9s. Thereafter I develop it in the AZ Developer for a few seconds. After the required metal film is evaporated on the open areas in the resist, the AZ5214E is stripped off in acetone with slight agitation. If anybody else has better suggestions to suggest for lift-off, I am all ears. Mr. Jeffrey Mun Pun YUE 余文彬 Division of Bioengineering Block E3, #05-18, Nanobioanalytics Lab 9 Engineering Drive 1 National University of Singapore Singapore 117576 Tel: (65) 65165985, Fax: (65) 68723069 E-mail: g0500396@nus.edu.sg Website: http://www.bioeng.nus.edu.sg/people/trau/Lab_index.htm -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of Ravi Shankar Sent: Tuesday, January 16, 2007 1:37 AM To: mems-talk@memsnet.org Subject: [mems-talk] Lift-off Recipe Hi all, I need to use lift-off process for my device fabrication.. So far we haven't standardised lift-off process in our lab. We are suing S1813 and HNR 120 photoresists... Is it possible to achieve lift-off process with these low thickness photoresists? Can any one suggest recipe for lift-off process.. suggestions will be highly appreciated.