Yes, I think you should try optimizing your temperature and time.  You should
also try hard-baking on a hot plate.  I've found that using a hot plate is
better than using an oven for almost all baking steps; I guess this may depend
on the type of resist you use.

David Fozdar

University of Texas at Austin
Department of Mechanical Engineering - Thermal-Fluids Systems
Center for Nano Molecular Science and Technology

Quoting junyu@berkeley.edu:

> Hi, I'm a graduate student at UC Berkeley. I used S1818 for high density
> 2um feature photolithography on Si wafer. The pattern looks great after
> development with MicroDev. However, after hard bake in a 125oC oven for 30
> min, the fine features turned into an area of mud/spagattii kind of mass.
> Larger features, 100um lines, were still fine.
>
> Does this mean my S1818 is bad? Or is this an intrinsic problem of S1818?
> Should I reduce the hardbake temperautre and time?