Hi Rupesh,

When transferring the wafers to the furnace a drop of isopropanol (cleanroom
grade) on one of the inlets works. I do that all the time and see no
problems in de bonding. Good luck.

Cheers, Paul

-----Original Message-----
From: Rupesh Sawant [mailto:rupesh.sawant@gmail.com]
Sent: maandag 5 maart 2007 20:58
To: General MEMS discussion
Subject: [mems-talk] Glass Thermal Bonding

I am trying to bond glass slides thermally. But I am facing problem in
transferring the aligned glass slide to the furnace. My procedure of
alignment is as follows:

I stick the glass slide having integrated electrodes on it to a plane
square glass plate. This plate is then fixed in position of the glass
mask in the aligner.
The slide having the channels is kept on the wafer stage of the
aligner and the alignment is done.
But after the alignment I need to transfer the slides to a furnace
nearby. How do i take the aligned slide (no bonded yet) to the
furnace. Can someone suggest me a technique to hold the aligned slides
temporarily in place till I put them in furnace.