Hi Daniela,

I'm not familiar with PI-2574, but we have had problems with
delamination of the photosensitive polyimide PI-2737. We solved this
problem by using a longer prebake (10 min instead of 1 min) at the same
temperature. Adhesion promoters for polyimides are available, but I
haven't had much success with them.

Jason Milne
Microelectronics Research Group
The University of Western Australia



-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Daniela Kögler
Sent: Wednesday, 21 March 2007 9:49 PM
To: 'General MEMS discussion'
Subject: AW: [mems-talk] polyimide

Hi,
I also work with the polyimid PI-2574.
I cured the polyimid at 110 degrees 3 minutes and it got etched and
transferred the pattern of a second photoresist layer. Unfortunately the
polyimid lost the adhesion to the si-wafer by the removal of the
photoresist.

I tried to cure the polyimid at 160 degrees; unfortunately it did not
get
etched with the photoresist.

Is there a chance to etch the polyimid with photoresist developer AND
remove
the photoresist afterwards?