Deschutes Corporation is a company making a Focused Ion Beam MEMS production
and prototyping tool. The beam can mill (sputter) material on a nano scale.

Would you be interested in knowing more about this? If so replay to me,
Steve Rosenberg sar@coho.net.

Thanks
-----Original Message-----
From: Karin.Hermansson@BCO-Technologies.com

To: MEMS@ISI.EDU 
Date: Thursday, June 11, 1998 3:56 PM
Subject: RE: anisotropic etching of <100> wafers


>As far as I know, most of the IPA will always float on top of the KOH.
However, a small amount of the IPA will dissolve, and this should be enough
for both changing the anisotropy properties and reduce
>undercutting.
>
>Good luck!
>
>Karin
>
>***************************************************************************
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>Dr. Karin Hermansson
>European Marketing Manager
>BCO Technologies PLC
>339 Glen Road
>Belfast BT11 8BU
>United Kingdom
>Tel: +44 1232 615599
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>-----Original Message-----
>From: PC :jhku@dewell.dewell.co.kr [SMTP:PC :jhku@dewell.dewell.co.kr]
>Sent: Thursday, June 11, 1998 8:15 AM
>To: MEMS@ISI.EDU;  scott.blackstone@BCO-Technologies.com;
Karin.Hermansson@BCO-Technologies.com
>Subject: anisotropic etching of <100> wafers
>
>I have got some questions regarding to anisotropic etching of  <100>
>wafers
>we are etching v-grooves on 4" <100> wafers.  there are some problems
>about  silicon undercutting.
>I heard that isopropyl alcohol may be added to reduce the undercutting.
>but Isopropyl alcohol does not mix with water .
>We are now using KOH+ D.I water etchant  and considering new method to
>add  isopropyl alcohol.
>I want to know the way to mix with isopropyl alcohol. we tried some
>methods using stirrer etc but failed.
>If you have a good method. please tell me the method as soon as
>possible!
>
>
>
> << File: ENVELOPE.TXT >>
>
>