Two ways to increase adhesion.  1) Bombard with an inert plasma such as
Argon.  This increases the surface area similar to shot blasting but on
an Angstrom level.                         2) Change the surface tension
using appropriate silanes and dehydration.  The trick here is to match
the surface tension change to the surface tension of the layer to be
applied to the treated layer.  Contact me for further technical
information.
Bill Moffat, CEO
Yield Engineering Systems, Inc.
203-A Lawrence Drive, Livermore, CA  94551-5152
(925) 373-8353
bmoffat@yieldengineering.com
www.yieldengineering.com


-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Yu, Zeta (Tak For)
Sent: Thursday, April 05, 2007 2:24 AM
To: General MEMS discussion
Subject: [mems-talk] Adhesions between interfaces of: SU8 on parylene
onsilicon

Dear MEMS Fellows,

I deposited >100um SU8 on 6um parylene on a silicon wafer. After the
process, I found that the adhesions between SU8 / parylene and parylene
/ Si are not as good as expected. SU8 can be peeled off from parylene
easily, as compared to SU8 / Si. And parylene film underneath SU8
pattern does not attach to Si anymore (perhaps stress from SU8 stretch
the parylene from conforming Si).

Would you mind to share the promoters and the processes /references that
promote these 2 interfaces so that I can have a better start? I searched
through google / mems-exchange, yet could not find much relevant
information.