Hi John,

In the past we had a few issues with Ti not having a good adhesion to glass.
One of the things that helped us was adding some nitrogen in the first few
seconds of Ti deposition step (TiN) and then going back to Ar only for Ti.

I hope this helps.

Thanks
Ravi
Hionix, Inc.
2144 Bering Drive
San Jose, CA 95131
408-526-2333 X-305
408-762-4305 (Fax)

-----Original Message-----
From: John Dangtran [mailto:jdangtran@s3cinc.com]
Sent: Tuesday, April 10, 2007 12:32 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Metallization Peel on Anodic Bonded Glass Wafer

Dear all,

Could anyone shed us a light to the problem?  I use Ti-Pt-Au on glass, which
is anodically bonded to silicon substrate with bad results, the metal
adhesion failed.  In the past, we had good results on the 4" wafers until we
switched to the 6".  We sputter- etched 500A of glass before depositing
Ti-Pt-Au.

Thank you,

John