Hi all,

After Cu plating on a TiAu seedlayer I etched the seedlayer in a KI/I2
solution, but a lot of residues remained, maybe as a result of formed CuAu
intermetallic(?)
Analyses showed a large Cu contant of these residues. Wet etching in Cu
etch  and afterwards  Ion Beam Etching, didn't solve this problem yet.
Do you have any suggestion for this?

Thanks,
Peter Kuijpers
MiPlaza
DTS/TFF

mailto:p.e.m.kuijpers@philips.com