It depends on your implanting conditions.  If the wafer gets hot (200C)
during implantation or the resist or the resist is implanted  too, it
will not remove as easily as one may expect.  You may also consider
taping the piece with an Al tape.  It sounds messy but has worked well
for me for holding samples of different shapes in a MEVVA implanter

Shekhar


Christophe Sudre wrote:
>
> Hi everybody
>
> I'm going to do some process with SiC wafers. The problem is the machine
> I can use are designed for 4 inch wafers .. and my SiC wafers are 1.3
> inch cutted in four !!! For the sputter deposition machine, no problem,
> I can use a metal wafer with clips to fix the little wafer. For the
> implanter, I can't use that and I must stick the wafer on a 4 inch Si
> wafer. The only way I see is to use resist. Do you have other ideas ?
> Did somebody use resist as paste ? How did you that ?
>
> Many thanks per advance, Christophe Sudre
>
> --
>
_______________________________________________________________________________
> | Dr Christophe Sudre                             Fax :   353 21 270271
|
> | Research Scientist                              Phone : 353 21 904079
|
> | University College Cork                         WWW :
http://www.nmrc.ucc.ie/|
> | National Microelectronics Research Center       Email: csudre@nmrc.ucc.ie
|
> | Lee Maltings, Prospect Row
|
> | Cork, Ireland
|
> |_____________________________________________________________________________
__|
>
>

--
Shekhar Bhansali Ph.D.
Senior Research Associate
CMSM, University of Cincinnati
PO Box 210030
CINCINNATI OH 45221-0030
PH: (513) 556-1997 Fax: (513) 556 7326