Hello Kris,

I'm very interested in the recipe of your Au -Au bonded wafers, since I'm
also getting involved
in wafer bonding.

Thanks in advance,

Peter Kuijpers
MiPlaza
DTS/TFF
High Tech Campus 04
Room: WAGp5-11
5656 AE Eindhoven
The Netherlands

Phone.:  (+31 40 27) 98904 (mobex)
mobile:(+31) 06-12507027
fax.:     [+31 40 27) 44769
mailto:p.e.m.kuijpers@philips.com


kris  writes:
Subject [mems-talk] bonded wafers dice Classification

Hello,

I was wondering if we can dice a Au-Au
thermocompression bonded wafer pair using the diamond
saw.

I need individual dies from the wafer pair to go for
the etch trails.