Hi Peter,
Cathodic activation at 20mA/cm2 in 10%sulfuric. Keep wet. Plate gold.
Regards,
David Roberts (Wafer Plating Specialist)
Prodigy Surface Tech
Santa Clara, CA

-----Original Message-----
From: P.E.M. Kuijpers [mailto:p.e.m.kuijpers@philips.com]
Sent: Wednesday, May 09, 2007 10:50 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Au electroplating

Hello Kris,

We did  also electroplating of Au (sulphite based)on Ni, but we observed a
very bad adhesion of Au onto the Ni seedlayer.
Did you observed this also or do you have a special pre-treatment to
overcome this?