durusmail: mems-talk: Adhesion layer for Nickel during Liftoff process
Adhesion layer for Nickel during Liftoff process
2007-05-12
2007-05-14
Adhesion layer for Nickel during Liftoff process
madhav rao
2007-05-12
Hi All,
       I had sputtered Titanium layer. then I did spin
oat of PMMA. After exposing it (E-beam lithography),
Nickel was deposited using E-beam evaporation. Finally
Liftoff was carried out to remove PMMA. However after
liftoff, I could not see any Nickel and Titanium.
Please let me know, which is the better adhesive metal
for Nickel in Liftoff process.

Thanks

Regards,
Madhav.
MicroEp department,
Research Assistant,
University of Arkansas, fayetteville
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