Hi Jeffrey,
   You are quite likely to have problems.  In the past we have tried to wire
bond to platinum pads (200nm thick) atop 6 um polyimide. It was not possible to
produce reliable wirebonds until the polyimide thickness was reducded to 3 um.
One significant source of problems was delamination of the metal layer due to
the ultrasonic energy.  We got around this by lowering the energy to 2.0-2.5 on
a ball bonder (max of 10).  I think SU-8 is a bit harder than polyimide so maybe
you will have fewer problems.

-Michael
 U. of Louisville

>>> "Yue Mun Pun, Jeffrey"  5/11/2007 9:30 AM >>>
Hi,
I need to bond gold wires to gold electrode.  Typically, how thick should the
gold electrode be and what should the surface area of the electrode be for a
good bond?
Also, will there be any impact if the gold electrode is sitting on a film of
SU-8, for if ultrasound is used in the bonding process, I'm afraid that the
underlying SU-8 might crack due to the high energy of the ultrasound.