Hi Leo,

We bonded some samples around 250-300C on our flip chip machine with
around 5-10N force for 2-5min. Make sure both surfaces are oxide free.
You also could enhance the strength by heat threatment around 300C for
0.5-1hrs.

Hope this help.

Regards

Heyshan MENDIS
+61 8 82595728


-----Original Message-----
From: Xiaoguang Liu [mailto:ziiiphyr@gmail.com]
Sent: Sunday, 17 June 2007 5:57 AM
To: General MEMS discussion
Subject: [mems-talk] Au-Au bonding

Dear MEMS community

I need to bond two pieces of silicon substrate together. They both have
electroplated gold of 17.6um. I wonder what would be a good way to bond
them together.

I've heard of thermal-compression bonding. Could someone recommend  some
good references to this method? Thanks

btw. my samples are small. they are about 6mm x 6mm