Dear friends,

Our group is using silicon-to-glass anodic bonding.

We are using the (111) SOI wafer and after releasing the movable mass, we
perform the anodic bonding process.

(we are using the comb drive structure for capacitive sensing)

But, many of the movable masses are pulled-in to one-direction. (to the
prior direction)

Did anyone who uses anodic bonding for hermeticity ran into these kind of
problems?

(And can you please advise me about the solution? (maybe solution-like
attempts))

I¡¯m thinking about the electrostatic force problem but since all the
bonding surface is isolated to one another.. hmm

I¡¯m stuck.

So, please give any kind of your kind ideas, thanks!!

Sangmin