Gene:

Tepla has had good success in removing some sidewall polymers produced by
the Bosch process using Microwave Plasma.

                 Regards

                         Steve


Stephen K. Wilson
U.S. Regional Area Manager
Semiconductor Equipment
Plasma Systems Division

PVA Tepla America, Inc.
251 Corporate Terrace
Corona, CA   92879 USA

Tel:          714-832-3113
Fax:         714-832-4227
Email:     stevew@pvateplaamerica.com
Internet:   www.pvateplaamerica.com

> -----Original Message-----
> From: mems-talk-bounces@memsnet.org
> [mailto:mems-talk-bounces@memsnet.org] On Behalf Of G Gan
> Sent: Monday, June 25, 2007 1:29 PM
> To: mems-talk@memsnet.org
> Subject: [mems-talk] How to remove polymer on the sidewall after DRIE?
>
> I am trying to find a process (prefer plasma) to remove the
> residual polymer on the side-wall after DRIE etch (Bosch
> process). I am sure some people have done this before, can
> you let me know the process (O2 plasma or other?) Btw, how
> can you measure the residual polymer thickness before and
> after stripping process? Thanks!
>
> Gene