Dear all,

I met a problem of electrical resistivity rising. My measured resistance of
metal layers (80 nm Pt or Au plus 20 nm Ti as adhesion) was 8 times higher
than my calculation using literature data. I deposited them using e-beam
evaporator without breaking the vacuum.

My questions are:
(1) Is it normally? Any possible reason(s) for this variation? It is highly
appreciated if you can provide any publication regarding this issue.
(2) Will the mechanical properties of the metal films, especially specific
heat change also? what is the trend of possible change?

Thanks,
Josh