Dear All,
I am currently working on the polymer based (Polystyrene) micro fluidic
device. The combined device has two layer top and bottom. Top layer
contains the micro channel (50uM) and the bottom layer contains the
micro electrode which is 150nm thick. I am facing problem for the
bonding. Polystyrene Tg is near 100 degree. I got good result if I
follow thermal (vacuum) bonding procedure at the bonding temperature 105
degree with slow ramp of heating and cooling. But the problem is after
bonding the micro electrode cracks due to expansion of the polymer
layer.
I have also tried with the ultra sonic bonging, but have not any good
result.
I can have any suggestion regarding the bonding problem please?
Kind Regards,

Mamun Rashid


***************************************
Mamun Rashid
PhD Student
Centre for Nano & Microsystems
University of Teesside
TS1 3BA. U.K
www.mamun.info
+44(0)164 234 2428