Dear all,

I am bonding (Au-Au thermocompression bonding)two
different dies, one of them has electroplated Au on
it. The sacrificial layer removal of one die results
in the device release over the other die.

I have seen lot of stress in the released structure. I
was wondering if the the bonding temperature (400C) is
the main reason for the residual stress in the
electroplated Au??

Can someone suggest me or provide a reference for the
stress free or less residual stress Au electroplating.

I am using sulphite bath from Technic, Inc. My plating
setup is a typical beaker,electromagnetic stirrer,
platinum mesh and 4" wafer. I am using pulsed power
supply for the electroplating.

Your suggestions are highly valuable to me.

Thanks,
Kris