Pramod,
       You do not need an RIE for vertical side walls in a polymer.
Using image reversal any angle from -22degrees through vertical to + 22
degrees side wall is standard in positive resists as thick as 40 microns
to date.  Thicker should be no problem.  Contact me for free tests.
Bill Moffat, CEO
Yield Engineering Systems, Inc.
203-A Lawrence Drive, Livermore, CA  94551-5152
(925) 373-8353

bmoffat@yieldengineering.com

www.yieldengineering.com

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of PRAMOD GUPTA
Sent: Friday, August 31, 2007 1:17 PM
To: General MEMS discussion
Subject: Re: [mems-talk] RIE Question

I am also looking for a recipe to etch 10um deep polymer with vertical
wall profile(linewidth~8um with Al or NiCr mask, spacing~250um) with
SF6/O2/CHF3 gas chemistry using "Oxford Plasmalab 80 plus" system. If
any one has any kind of recipe or research paper please let me know.