Hi All,

Can someone of you provide me some bondsettings (Temp. time, pressure,
layerthickness)
for waferbonding of eutectic Au-In layers??

Thanks in advance.
Peter Kuijpers
MiPlaza
DTS/TFF
High Tech Campus 04
Room: WAGp5-11
5656 AE Eindhoven
The Netherlands

Phone.:  (+31 40 27) 98904 (mobex)
mobile:(+31) 06-12507027
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mailto:p.e.m.kuijpers@philips.com