A couple questions:

Is the coat defect dependent on the topography of the wafer? (i.e. Do you
get the striations/ripples when you coat a flat wafer with no topography?)

Depending on the topography, such radial patterns may be unavoidable with
your coat.

So you are trying to put down .2 - .5um coating on 10um tall posts.  Are the
sidewalls beveled? or straight up and down?  If so, you will not get good
sidewall coverage.  Or is that what you mean by the "recesses" which
wouldn't be a concern.

On 10/24/07, Sandip Agarwal  wrote:
>
> I am not trying to planarize the substrate. I want a coat ~ 0.2-0.5
> microns of the polymer on the posts of the substrate. Of course, there
> would stuff on the recesses, but that's not a concern.


--
Regards,
dbp