Hi,

I have a question on how and what material can be used to bond SiN (wafer 1)
with SiN (wafer 2). Secondly, does anybody know what process can be used to
totally remove a part of back side Si Wafer without affecting the SiN layer  at
the front side.

Any suggestion on foundry that can do all the processes is appreciated.

Thank you.

Hafizah