Chemical etchants such as KOH or EDP can remove the Silicon with good
selectivity.

Nicolas Duarte
Ph.D. Candidate at Penn State University

On Oct 30, 2007, at 12:12 AM, Nor Hafizah Ngajikin wrote:

> Hi,
>
> I have a question on how and what material can be used to bond SiN
> (wafer 1) with SiN (wafer 2). Secondly, does anybody know what
> process can be used to totally remove a part of back side Si Wafer
> without affecting the SiN layer  at the front side.
>
>

Nicolas Duarte
Ph.D. Candidate at Penn State University