I have been depositing thin metallic films on glass substrate using an E-beam
evaporator in the following order:

Ti(15nm)/Cu(200nm)/Al(1.2micron) - After deposition, I anodize the aluminum
layer and during anodization at constant potential the current is 2mA - This
process works fine!

But, when I use the following sample: Ti(15nm)/Au(200nm)/Al(1.2micron) and after
e-beam deposition, when I anodize the film at constant potential, the current is
100-140mA which is unusually high. After anodizing for a couple of minutes, the
aluminum lays just dissolves away.

Does anyone have any suggestions as to why this may be happening. Is the problem
associated with the deposition of these metallic layers or something else? Any
information or suggestions will be very helpful

Yeswanth L Rao
UGA
Athens, GA