Hi Joe,

   I've done it on a flip-chip bonder a few times with small pieces. I
don't know what sort of mechanical strength it has but for holding small
MEMS devices, it seems to be satisfactory. I used an Ar RIE plasma to
activate the Au surfaces (150W, ~20 mTorr Ar, 1 minute) then used a
thermocompression bonding sequence in the flip chip bonder to align, and
stuck the pieces together using 3 kg pressure, at 300C for 5-10 minutes.

Felix

Joseph Grogan wrote:
> Is there anybody out there with personal experience performing wafer
> bonding by gold-to-gold thermocompression bonding? I've found several
> papers, and performed several experiments, but I'm getting mixed
> results and I'd like to discuss my process with someone who's done it.
>
> thank you,
> Joe Grogan