Dear All,

Has anyone experience with glass frit bonding using
photolithography to pattern a photoresist / frit mixture?

We are having difficulties getting a successful process for
bonding quartz to quartz. The recommended frit to get a good
thermal expansion match for quartz must not exceed its
transformation point of 290 deg C during resist removal.
The problem is that the recommended burn-off temperature
for the photoresist is 380 deg C, well above the
transformation point. The incomplete removal of the resist
(at the lower burn-off temperatures that we have had to use)
seems to be preventing successful bonds; or is this a red
herring?  What is the best way of fully removing the resist
from the frit after patterning?

Does anyone have an reliable process for bonding quartz to
quartz with patterned glass frit? Thank you.

Best regards,



David Adamson,
Applied Microengineering Ltd.,
68, Milton Park,
Abingdon,
Oxfordshire.
OX14 4RX
Tel.: (01235) 833934
Fax : (01235) 833935
WWW : http://www.aml.co.uk