Hello Elina, 1. I'd suggest, that you saw your dies prior to making the cantilever beams free (underetching the sacrificial layer, or whatever you do). Then simply process your dies separately. 2. This approach, however, works well only in case your dies and beams have relatively big dimentions (otherwise you naturally will have to work with too many units). If they are very small, than you possibly could temporarily cover your prepared wafer with some transparent organic material which will protect the beams, saw the wafer, and finally remove this protective material. Regards, Denis Petrov