Michael, just a guess but I would think TiN reactively sputtered and with a
good gold like appearance (not greenish) indicating stochimetric proportions
might work. Gary

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org]On Behalf Of Michael D Martin
Sent: Wednesday, March 05, 2008 9:58 AM
To: General MEMS discussion
Subject: Re: [mems-talk] Anneal recipe for Pt thin film on Si wafer


I've had this problem in the past, i.e. formation of Pt-Si alloys during an
anneal with (I think) a Cr adhesion layer.  Could anyone recommend a
material stack Pt/ adhesion layer/ diffusion barrier?

Thanks,
   Michael
   U. of Louisville

>>> Oliver Horn  3/3/2008 4:38 AM >>>
Hello Natsuki,

you will get PtSi or PtSi2 if you heat up Pt on Si without diffusion
barrier, even at 260°C.  The adhesion is only a bit improved.

Oliver