Florian,

Try heating the microstrip (>40) and/or sonication, that should get rid of
your imide-base polymers and keep TiO2 in good conditions.
In another note, SC1 and SC2 should not damage TiO2. As long as the clean
solution contains a small amount of peroxide, it should inhibit any metal
etching.

cheers!

_fm

On 4/6/08, Michael Larsson  wrote:
>
> Hi Florian,
>
> You can remove the organic residues using an SC1 solution, consisting
> of NH4OH, H202 and H20 in the ratio:1:1:5. The SC1 solution (in
> various mixing ratios) is really the IC industry standard for wet
> removal of organic surface contamination.
>
> I am not sure how this will react with the TiO2 layer, but the absence
> of H2SO4 should improve things. The Pirahna solution is a very
> aggressive cleaning step, aimed at removing general surface
> contamination (metal or organic) as a preliminary step to SC1 and SC2
> cleans. The SC2 clean contains HCl (in substitution of NH4OH in SC1),
> aimed at eliminating metallic contamination.
>
> If you find that your TiO2 is still being etched, alter the mixing
> ratio (add DI) or reduce the reaction time.
>