Hi,

I am using photoresist KMPR on silver layer, for later DRIE. But the photoresist
seems very subtle.Does anyone know the exact exposure energy of this
photoresist?And when I etched silver after PR, undercut happened badly. Even
after DRIE, when removing KMPR residue by Remover RG, silver will peel off too.
Is this because the adhesion between silver and silicon is very weak? If yes,
how can i enforce the adhesion?

Thanks.