There is an old message about the second situation.

Hope it helps.

The URL is

http://mail.mems-exchange.org/pipermail/mems-talk/2003-August/011034.html

                     Matthew


--- Guillaume Bougrine
写道:

> Hello,
>
> I am currently facing a problem with gold pads
> deposited on a tungsten layer.
> My gold pads are deposited by sputtering and
> patterned by lift off.
> When a gold wire contacts the pad, the pad-wire
> bonding is stronger than the tungsten-pad bonding
> and then the pad is removed.
>
> On one hand, I read papers where they assume this
> problem can come from the creation of a thin
> tungsten oxide layer which avoid a stronger bonding.
> Then the idea would be to etch tungsten a bit just
> before depositing gold. Do you think it is right?
>
> On the other, friends of mine faced a similar
> problem but with Silicon instead of Tungsten. They
> used a chrome layer in between Gold and Si (SiO2)
> and it worked. I cannot find any information about
> this for the moment... So, do you think it could
> work? (or do you know where I could find
> information?)
>
> Hope one of you will have an idea or at least will
> give me his/her opinion.
>
> Thank you,
>
> BOUGRINE Guillaume