Dear Andrea,

>From my experience in semiconductor fabrication, HF itself hardly etches
silicon.
In case of BOE(Buffered Oxide Etchant) which consists of HF and NH4F, silicon
can be etched due to 'NH4'. It is very slow but I don't have etch rate data.

Thanks,
SM

----- Original Message -----
From: "Andrea Mazzolari" 
To: "General MEMS discussion" 
Sent: Saturday, June 21, 2008 6:43 AM
Subject: Re: [mems-talk] Glass to Kovar anodic bonding


> Hi all,
> from my knowledge, silicon is slowly etched by HF. Is this information
> correct ? Which is the etch rate ?
> Many thanks,
> Andrea
>