I think you'll need to deposit (by PVD) Pd film or sth. similar on your
SiO2 substrate before electroless plating.

Gord Wang
Nanowave

-----Original Message-----
From: Cassie Iany [mailto:cassie.sg@hotmail.com]
Sent: June 26, 2008 11:17 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Electroless Cu plating

Hello,

I am doing Electroless Cu plating on SiO2 substrate. I found the
solution can deposit Cu film on Si but not SiO2. I tried to use
different self-assembly monolayer to modify the surface, but still not
succeed. One thing I am concerned about the SiO2 substrate cleaned with
Pirana solution has contact angle of 45 degree which is different from
other reported contact angle (nearly Zero degree). I don't know how the
difference comes.

Appreciate if you share your experience and suggestion.

Regards

Cassie