Dear MEMS-talk community

Our research group is interested in buying a flip-chip bonder for MEMS
applications and I would like to hear your opions about that. Normally we do
soldering and thermal-compression bonding. Occasionally we need anodic
bonding. We do have a home-made bonder that can do the bond pretty well but
with very limited alignment capability. Now that a few of our research
projects call for precision alignment, we've started thinking about buying a
commercial bonder. As a university lab, we do most of our processing with
pieces instead of full wafers. So the ability to take pieces is must.

I've done a little bit of research and found that KADETT K1 bonder from
Smart Equipment Technology seems almost an ideal piece of  equipment for us.
However, I'm no expert in the bonder market and therefore I'd really want to
hear your opinions about choosing the right bonder. I'm pretty sure there
are people in this channel that knows a lot more about bonders.

Thanks
Leo

--
Xiaoguang "Leo" Liu
Birck Nanotechnology Center,
Purdue University,
1205 W.State Street, West Lafayette, IN, 47906 USA
liu79@purdue.edu