Hi all

I am trying to etch Ni thin films using Trion's ICP RIE system. System
specifications are: ICP power can be varied from 0-1200W, RIE from 0-600W,
pressure from 10-120mT and has Ar, Cl2, BCl3, N2, CF4, O2. Photo resist (AZ5214
E, AZ5206E) was used to mask the Ni films. I am trying to etch circles with 1
micron  diameter in the  Ni films.

I tried different recipes but was not able to etch Nickle in the 1 micron
features. I used 24sccm Ar, 6sccm Cl2 different ICP, RIE powers at 20mt
pressure. Ni(30nm) was desposited using e-beam evaporator. After the process it
was observed that the photo resist was not etched completely but turned dark.

If someone can suggest me a recipe to etch Ni that will be very helpful.

Thanks
Sridhar