Well, somehow you need to find a way to bias Si.  And with an SiO2 middle layer
that may be hard.  You also have to dope the a-Si.  I had bonded similar stacks
in grad school, see my JMEMS paper in 1996 and transducers in 1997.  thanks,

-Mehmet

------Original Message------
From: li shifeng
Sender: mems-talk-bounces@memsnet.org
To: mems-talk@memsnet.org
ReplyTo: General MEMS discussion
Subject: [mems-talk] glass and coated thin film silicon anodic wafer bonding
Sent: Sep 18, 2008 1:32 PM

Hi, colleagues,

I want to bond glass and silicon wafer using anodic bonding. The silicon wafer
is coated with 20nm SiO2/20nm a-Si/20nm SiO2 stack film. The glass wafer is
etched channels with 100nm width and 50 nm depth. I am wondering if there are
any problems to bond them.