I've experienced spikes (probably a crystal formation) forming in a gold
film when heated to 400-500 degC.  The stack consisted of 1um SiO2/300nm
Cr/600nm Pt/1um Au on a Si wafer.

Roger Shile

-----Original Message-----

You might consider using a diffusion barrier layer between the nitride
and Au.  Also, watch out for eutectic alloys with your adhesion layer.

-Michael

>>> "abhaya joshi"  9/18/2008 10:20 PM >>>
Hi all

i am having gold layer of 1.5 um on Si3N4 coated Si wafer.
i would like to treat this wafer at 650C.
what will be the effect on gold.

in my previous experiment, the when i coated the gold on silicon and
treated
for 600C., i observed the re-flow of gold.
can any one tell me the cause for this?