Thanks for the replies.

I am definitely trapping air in the vias. I have
tried doing a PGMA puddle (resist solvent) to let it fill the via, and
follow with resist and have it wick down the via. X-sections appear to show
that the PGMA didn't reach the bottom of the via. I assume some sort of
de-wetting. I'd love to try spray, but capital expenditures are frozen.

I'm trying to fill and planerize the top side before backside pattern.

Robert

-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]
On Behalf Of Jan Newman
Sent: Tuesday, October 28, 2008 5:58 AM
To: 'General MEMS discussion'
Subject: Re: [mems-talk] Filling deep vias with resist

Hi Robert,

         Do you need to fill them or merely protect the internal surfaces?
If only protection required the EVG Nanospray will do the job.
If you need to fill them then the spray can act to initially wet the
internal surfaces and help fill during coating.

Jan