Hi,

I  have a stack of 50nm of Ti and 400nm of Nickel(patterned on a glass
substrate) and I require to etch them to expose the glass underneath.
I know that for Ti, HF is a fast etchant and for Ni, it is a slow etchant.In
fact HF is not a good etchant for Ni and the etching of Ni gradually slows
down in accordance to the abundance of HF in the etchant.However due to some
other material constraints and selectivity issues, I need the stack of Ti
and Ni to be etched by HF only.

Can you suggest me any suitable recipe for this process so that I can get a
suitable etching rate of both Ti and Ni(etching may be moderately slow but
not too slow)?

Thanks!

---ANIRBAN
Electrical Engineering
Louisiana State University
Baton Rouge
70802,USA