Are these conditions dependent on the plating solution composition?

Shay?

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From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]
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Sent: Wednesday, November 19, 2008 1:51 AM
To: mems-talk@memsnet.org
Subject: Re: [mems-talk] Cu electroplating uniformity problem

My research is about the uniformity control of electroplating.

There's one conclusion of my research paper:

The uniformity and profiles of electroplated nickel posts are controlled
mainly by plating current density and temperature. Optimal conditions of
8.05mA/cm2 and 20°C were obtained to fabricate flat cross-sectional profile
microstructures and a uniform thickness distribution across a specimen.