Hi,

Are you talking about a glass wafer?  So, why do you want to use HF?

2008/11/17 ANIRBAN SARKAR 

> Hi,
>
> I  have a stack of 50nm of Ti and 400nm of Nickel(patterned on a glass
> substrate) and I require to etch them to expose the glass underneath.
> I know that for Ti, HF is a fast etchant and for Ni, it is a slow
> etchant.In
> fact HF is not a good etchant for Ni and the etching of Ni gradually slows
> down in accordance to the abundance of HF in the etchant.However due to
> some
> other material constraints and selectivity issues, I need the stack of Ti
> and Ni to be etched by HF only.
>
> Can you suggest me any suitable recipe for this process so that I can get a
> suitable etching rate of both Ti and Ni(etching may be moderately slow but
> not too slow)?

Best regards,
Yours sincerely
Fei Wang
Postdoctoral researcher, Dr
MIC - Department of Micro and Nanotechnology
Technical University of Denmark (DTU)
Building 344, 1st floor, Room no. 130
DK-2800, Kgs. Lyngby
Denmark
Tel:  +45 4525 6311
Fax:  +45 4588 7762
Email: fei.wang@nanotech.dtu.dk
      http://www.nanotech.dtu.dk